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CLG484 CL484 CLG485 CL485 Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf UFBGA-132, 12x12 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 2x35 2.00mm double row surface-mounted straight pin header, 2x36, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7!), script generated Through hole angled socket strip THT 1x04 2.00mm single row Surface mounted socket strip THT 2x30 2.00mm double row surface-mounted straight socket strip, 1x06, 2.00mm pitch, 6.35mm socket length, single row Through hole socket strip SMD 1x40 1.00mm single row style2 pin1 right Through hole angled pin header SMD 1x23 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x23 2.54mm double row Through hole straight pin header, 2x35, 1.00mm pitch, double rows Through hole pin header THT.

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