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4.223x3.969mm package, pitch 0.4mm pad, 15x15mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00855D.pdf#page=1 TFBGA-196, 11.0x11.0mm, 196 Ball, 14x14 Layout, 0.75mm Pitch, http://ww1.microchip.com/downloads/en/DeviceDoc/SAMA5D2-Series-Data-Sheet-DS60001476C.pdf#page=2956 FBGA-78, 10.6x7.5mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7b3ri.pdf ST TFBGA-257, 10.0x10.0mm, 257 Ball, 19x19 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 324 0.8 CS324 CSG324 BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YZF, YZF0016, 2.39x2.39mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-225, 13.0x13.0mm, 225 Ball, 15x15 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7b3ri.pdf ST TFBGA-257, 10.0x10.0mm, 257 Ball, 19x19 Layout, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf 3x3mm Body, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wl54jc.pdf ST UFBGA-121, 6.0x6.0mm, 121 Ball, 11x11 Layout, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf 3x3mm Body, 0.5mm Pitch (http://www.ti.com/lit/ds/symlink/lm4990.pdf WSON, 12 Pin (http://www.ti.com/lit/ds/symlink/ldc1312.pdf#page=62), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 28 Pin (http://www.issi.com/WW/pdf/31FL3731.pdf#page=21), generated with kicad-footprint-generator JST ZE series connector, BM05B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M2, height 3.5, Wuerth electronics 9774070960 (https://katalog.we-online.de/em/datasheet/9774070960.pdf,), generated with kicad-footprint-generator JST XA series connector, B3P-VH-B (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WSON6 3*3 MM, 0.95 PITCH; http://www.ti.com/lit/ds/symlink/lmr62421.pdf 8-Lead Plastic WSON, 4x3mm Body, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline Narrow Body Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/70593d.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5180, 18 Pins (http://www.molex.com/pdm_docs/sd/903250004_sd.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 502386-0470 (http://www.molex.com/pdm_docs/sd/5023860270_sd.pdf), generated with kicad-footprint-generator JST ZE series connector, 53398-1071 (http://www.molex.com/pdm_docs/sd/533980271_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 8.6, Wuerth electronics 9774015360 (https://katalog.we-online.de/em/datasheet/9774015360.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, 53398-0871 (http://www.molex.com/pdm_docs/sd/533980271_sd.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5180, 18 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST GH.

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