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48 pin, exposed pad: 4.5x8.1mm, with thermal pad HTSSOP32: plastic thin shrink small outline package; 18 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic DFN (5mm x 3mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (SO) (http://www.everlight.com/file/ProductFile/201407061745083848.pdf 5-Lead Plastic Small Outline (SM) - 5.28 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of MSOP-16 (see http://cds.linear.com/docs/en/datasheet/3630fd.pdf 12-Lead Plastic Micro Small Outline Package (MS) [MSOP], variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil 8-lead dip package, row spacing 7.62 mm (300 mils), Socket 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 32-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 8x-dip-switch SPST Copal_CVS-08xB, Slide, row spacing 9.53 mm (375 mils 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300.

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