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3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 4mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic DFN (4mm x 4mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic DFN (1.3mm x 1.2mm DFN, 8 Pin (https://www.nxp.com/docs/en/data-sheet/TJA1051.pdf#page=16), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1430.

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