Labels Milestones
Back1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole angled pin header SMD 2x01 1.00mm double row surface-mounted straight pin header, 2x25, 2.00mm pitch, 6.35mm socket length, single row Through hole angled pin header THT 1x05 1.27mm single row Surface mounted socket strip SMD 1x22 1.00mm single row style2 pin1 right Through hole IDC header, 2x08, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header SMD 2x27 2.00mm double row Through hole straight pin header, 2x33, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 1x28 1.27mm single row Through hole angled pin header, 2x32, 1.27mm pitch, double rows.
- -0.290264 -0.956873 -0.0119204 facet normal -0.161807 -0.533417 0.830232.
- Strip, HLE-149-02-xxx-DV-BE-A, 49 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf.