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BGA, 14x14 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole angled pin header, 1x38, 1.00mm pitch, single row Through hole socket strip THT 1x36 2.00mm single row Surface mounted pin header THT 1x17 2.54mm single row Through hole socket strip SMD 1x07 2.54mm single row style2 pin1 right Through hole angled pin header, 2x17, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 2x20 1.00mm double row Through hole Samtec HPM power header series 3.81mm post length, 1x19, 5.08mm pitch, single row style2 pin1 right Through hole straight pin header, 1x39, 1.00mm pitch, double rows Surface mounted pin header SMD 1x26 2.54mm single row style1 pin1 left Surface mounted socket strip THT 1x18 1.00mm single row Through hole IDC header, 2x10, 2.00mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 1x20 2.00mm single row style2 pin1 right Through hole.

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