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Outline (ST)-4.4 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole horizontal IDC header THT 2x22 1.27mm double row surface-mounted straight socket strip, 1x26, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x15, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 2x25 1.27mm double row Through hole angled socket strip SMD 2x05 2.54mm double row Through hole socket strip SMD 2x37 1.00mm double row surface-mounted straight socket strip, 2x20, 2.00mm pitch, single row Through hole straight socket strip, 1x25, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight pin header, 1x38, 2.00mm pitch, single row Surface mounted socket strip.

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