Labels Milestones
BackPad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments EUW 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Surface mounted pin header SMD 2x13 2.00mm double row Through hole straight socket strip, 1x01, 1.27mm pitch, 4.0mm pin length, double rows Through hole angled pin header, 2x18, 1.00mm pitch, double rows Through hole IDC header, 2x12, 2.54mm pitch, 6mm pin length, single row Through hole angled socket strip SMD 1x33 2.54mm single row Through hole socket strip SMD 2x09 1.27mm double row Through hole IDC header, 2x30, 2.00mm pitch, double rows latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight socket strip, 2x04, 1.27mm pitch, 4.0mm pin length, single row Through hole straight pin header, 1x08, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x29, 1.27mm pitch, single row (from Kicad 4.0.7!), script generated Through hole angled pin header THT 2x08.
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