Labels Milestones
BackPad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506CE.PDF DD Package; 12-Lead Plastic Micro Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT DIP DIL PDIP SMDIP 2.54mm 15.24mm 600mil SMDSocket SmallPads 4-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 6x-dip-switch SPST , Slide, row spacing 6.15 mm (242 mils), body size 9.78x7.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 1x-dip-switch SPST , Piano, row spacing 5.9 mm (232 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 7x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils.
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