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SOIC-8, 3.9x4.9mm² body, exposed pad, Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments HSOP 9, 1.27mm pitch, single row Surface mounted socket strip SMD 1x26 1.00mm single row Surface mounted socket strip SMD 2x37 2.54mm double row surface-mounted straight socket strip, 1x30, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7), script generated Through hole Samtec HPM power header series 11.94mm post length THT 1x01 2.00mm single row Through hole angled pin header, 2x22, 1.27mm pitch, double rows Through hole angled socket strip THT 2x18 2.00mm double row surface-mounted straight socket strip, 2x43, 1.27mm pitch, double cols.

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