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(http://www.molex.com/pdm_docs/sd/5013310207_sd.pdf), generated with kicad-footprint-generator JST GH series connector, B36B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B07B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Soldered wire connection, for 6 times 2.5 mm² wires, basic insulation, conductor diameter 0.5mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 09-65-2098, 9 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for a box film cap for 100v is smaller, but not limited to patent issues), conditions are met: * Redistributions of source code must retain the above copyright notice, this list of conditions.

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