Labels Milestones
BackDPDT, https://www.e-switch.com/system/asset/product_line/data_sheet/226/FS5700.pdf Switch with High Contact Reliability, Top-actuated Model, with Ground Terminal, with Boss Ultra-small-sized Tactile Switch for High-Density Packaging with Ground Terminal, without Boss Ultra-small-sized Tactile Switch with High Contact Reliability, Side-actuated Model, with Ground Terminal, with Boss Ultra-small-sized Tactile Switch SPST Slide 7.62mm 300mil LongPads 4-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x6.64mm 2x-dip-switch SPST Copal_CHS-02B, Slide, row spacing 11.48 mm (451 mils 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT DIP DIL ZIF 15.24mm 600mil SMDSocket SmallPads 22-lead though-hole mounted.
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