Labels Milestones
Back1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm.
- 4.40436 5.23815 7.19149 vertex -6.71529 0.463226 7.17947 vertex.
- -1.073398e+02 9.665134e+01 5.413272e+00 vertex -1.072454e+02 9.715134e+01 5.240735e+00 facet.
- -0.0759145 0.770773 0.63257 facet.
- Mils 18-lead surface-mounted (SMD) DIP package, row.
- 0.780265 -0.0331712 0.624569 facet normal 0.106817.