Labels Milestones
BackB02B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with StandardBox.py) (https://product.tdk.com/info/en/document/catalog/smd/inductor_commercial_power_slf6028_en.pdf Inductor, TDK, SLF7032, 7.0mmx7.0mm (Script generated with kicad-footprint-generator Hirose series connector, SM11B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M2, height 4.5, Wuerth electronics 9774035243 (https://katalog.we-online.de/em/datasheet/9774035243.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 9, Wuerth electronics 9774150960 (https://katalog.we-online.de/em/datasheet/9774150960.pdf,), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 40 Pin (JEDEC MO-153 Var HD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-133-02-xxx-DV, 33 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 24 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/product-documents/package-drawings/24L-VQFN%E2%80%934x4x0.9mm-MJ-C04-00143b.pdf), generated with kicad-footprint-generator Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-107-02-xxx-DV, 7 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.7mm, height 1, Wuerth electronics 9775031960 (https://katalog.we-online.com/em/datasheet/9775031960.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD Kemet-X (7343-43 Metric), IPC_7351 nominal, (Body size source: IPC-SM-782 page 80, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 14x14 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 18x18 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments EUK 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), Socket, LongPads THT DIP DIL ZIF 25.4mm 1000mil SMDSocket SmallPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x11.72mm 4x-dip-switch SPST CTS_Series194-4MSTN, Piano, row spacing 9.53 mm (375 mils), Clearance8mm 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL.
- Connector, normal polarization (https://multimedia.3m.com/mws/media/22424O/3mtm-cf-card-header-type-i-low-profile-surface-mount-ts0747.pdf.
- 40:40%, 50:50%] // Width of module (HP) width.