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CASE 122BX (see ON Semiconductor 506AF.PDF DKD Package; 32-Lead Plastic Thin Quad Flat, No Lead Package, 1.2x1.8x1.55 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf UQFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=164), generated with kicad-footprint-generator ipc_gullwing_generator.py SOP, 4 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF11-14DP-2DSA, 7 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-36S-0.5SH, 36 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST ZE series connector, B06B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated.

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