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482, 4.2x3.95mm, 90 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition.

• Vertex 4.97595 5.14541 6.88072 vertex 4.958 5.204 6.88408.
• Universal SMC (DO-214AB) RM10 Handsoldering SMD Thruhole.
• Shaft center=true); // Pointer1: Offset.
• 5x20mm closed horizontal Bulgin.

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