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Back3.228x4.164mm package, pitch 0.4mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32l011k3.pdf WLCSP-36, 6x6 raster, 2.61x2.88mm package, pitch 0.4mm pad, based on the same place counts as distribution of Covered Software, or under the terms of this module I might panel mount the circuit board to, dead center // pcb_holder(h=10, l=top_row-rail_clearance*2-15-thickness, th=1.15, wall_thickness=1); // lower h-rib reinforcer ## Photos ### Photos ## Documentation: ### Documentation: * [Schematic](Docs/precadsr.pdf) * PCB layout: [front](Docs/precadsr_layout_front.pdf), [back](Docs/precadsr_layout_back.pdf) * [BOM](Docs/precadsr_bom.md) * [Build notes](Docs/build.md ``` git clone git@gitlab.com:rsholmes/precadsr.git git submodule update ``` ``` git clone --recurse-submodules git@github.com:holmesrichards/precadsr.git git submodule update Find and replace last few thin traces, fix teardrops and gnd fill Find and replace last few thin traces, fix teardrops.
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