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X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, off-center ball grid, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A Zynq-7000 BGA, 26x26.

• 0.468318 -0.782844 0.409675 facet normal 0.471413 -0.881912 0.
• 4.344010e+000 3.615769e+000 1.747200e+001 facet normal -0.643697.

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