Labels Milestones
BackSwitch, 7.3mm x 6.25mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, pitch 0.65mm VFBGA-86, 6.0x6.0mm, 86 Ball, 10x10 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 1924 1 FL1925 FLG1925 FL1926 FLG1926 FL1928 FLG1928 FL1930 FLG1930 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition Appendix A Zynq-7000 BGA, 26x26 grid.
- (C) 2017 Alec Thomas.
- Vertex 4.78188 4.20094 7.71954 vertex 4.59658 4.30043 7.71246.
- 6x6mm e.g. PHAP33xx series, height=8mm tactile.
- 9.864331e-001 -1.641639e-001 0.000000e+000 vertex 4.782716e+000 -5.278760e+000 9.983999e+000 vertex.