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CASE 122BX (see ON Semiconductor 122BS.PDF PQFP, 100 Pin (https://www.nxp.com/docs/en/package-information/SOT407-1.pdf), generated with kicad-footprint-generator JST PUD series connector, LY20-12P-DT1, 6 Circuits (https://www.molex.com/pdm_docs/sd/2005280060_sd.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 43915-xx12, 6 Pins per row (http://suddendocs.samtec.com/prints/lshm-1xx-xx.x-x-dv-a-x-x-tr-footprint.pdf), generated with kicad-footprint-generator Molex CLIK-Mate side entry JST SH series connector, 502443-0770 (http://www.molex.com/pdm_docs/sd/5024430270_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 1.5 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 3mm, see http://www.metz-connect.com/de/system/files/METZ_CONNECT_U_Contact_Katalog_Anschlusssysteme_fuer_Leiterplatten_DE_31_07_2017_OFF_024803.pdf?language=en page 133, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00296, 11 pins, pitch 5.08mm, size 40.6x10.6mm^2, drill diamater 1.2mm, pad diameter 2.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 48 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation CA), generated with kicad-footprint-generator Molex CLIK-Mate series connector, S12B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator JST GH series connector, BM06B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-118-02-xxx-DV-BE-LC, 18 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-144-02-xxx-DV-LC, 44 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 24 Pin (http://www.ti.com/lit/ds/symlink/pca9548a.pdf#page=37), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-139-02-xxx-DV-BE-LC, 39 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator JST PHD series connector, 502585-1270 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 16 Pin (http://www.ti.com/lit/ds/symlink/drv8801.pdf#page=31 MO-220 variation VGGC), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=332), generated with kicad-footprint-generator ipc_noLead_generator.py 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 12-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 10.8x21.88mm 8x-dip-switch SPST Omron_A6H-8101, Slide, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 4x-dip-switch SPST CTS_Series194-4MSTN, Piano, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), SMDSocket, LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 22.86mm 900mil Socket 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 10-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils.

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