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DF13-03P-1.25DS, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 28 Pin.

• THT 2x26 1.27mm double row Through hole.
• 0.0600084 0.987629 vertex 3.66217 -0.11686 18.8084 facet.

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