Labels Milestones
Back, length*diameter=5.2*2.7mm^2, , http://www.diodes.com/_files/packages/DO-41%20(Plastic).pdf Diode DO-41_SOD81 series Axial Horizontal pin pitch 2.50mm length 4.6mm width 3.0mm Capacitor C, Rect series, Radial, pin pitch=5.30mm, , length*width=14*5.6mm^2, Bourns, 5700, http://www.bourns.com/docs/Product-Datasheets/5700_series.pdf L_Toroid Vertical series Radial pin pitch 11.44mm length 24.64mm width 15.5mm Pulse KM-4 L_Toroid, Vertical series, Radial, pin pitch=37.50mm, , length*width=41.5*35mm^2, Capacitor, http://www.wima.com/EN/WIMA_MKS_4.pdf C Rect series Radial pin pitch 2.54mm size 15.7x6.2mm^2 drill 1.1mm pad 2.2mm Terminal Block WAGO 236-216, 45Degree (cable under 45degree), 8 pins, https://www.diodes.com/assets/Datasheets/ZXSBMR16PT8.pdf 8-pin SOT-383FL package, http://www.onsemi.com/pub_link/Collateral/ENA2267-D.PDF SOT-543 4 lead surface package SOT 963 6 pins package 1x0.8mm pitch 0.35mm SOT-1123 small outline package; 24 leads; body width 4.4 mm; thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 122BX.PDF 32-Lead Plastic Thin Shrink Small Outline (SO) (http://www.everlight.com/file/ProductFile/201407061745083848.pdf 5-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN 4-Lead Plastic Small Outline (ST)-4.4 mm Body [QFN]; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zd.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/DM00366448.pdf WLCSP-168, 12x14 raster, 4.891x5.692mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf WLCSP-64, 8x8 raster, 3.141x3.127mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f031k6.pdf WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f410t8.pdf WLCSP-49, 7x7 raster, 3.029x3.029mm package, pitch 0.8mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf UFBGA-100, 12x12 raster, 5.24x5.24mm package, pitch 0.4mm; see section 6.2 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-265, 17x17 raster, 14x14mm package, pitch 0.5mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 15x15 grid, 13x13mm package, pitch 0.4mm pad, based on EPCOS app note at http://www.cypress.com/file/140006/download DFN, 6 Pin (https://www.silabs.com/documents/public/data-sheets/Si7020-A20.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System.