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BackSRP7028A Bourns SRP1208 SMD inductor Bourns SRN6028 SMD inductor Bourns SRP1770TA series SMD inductor Inductor, Bourns, SRP5030T, 5.7mmx5.2mm (Script generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP10: plastic thin shrink small outline package; 32 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG SSOP20: plastic shrink small outline package; 32 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 40 leads (see NXP sot054_po.pdf TO-92 leads in-line, narrow, oval pads, drill 0.75mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 18-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), Socket, LongPads 32-lead dip package, row spacing 15.24 mm (600 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads THT DIP DIL ZIF 25.4mm 1000mil Socket 3M 16-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils), Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 22-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 6x-dip-switch SPST KingTek_DSHP06TJ, Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 5-lead though-hole mounted DIP package, row spacing 5.25.
- Chilisin, BMRB00050518-B, 5.4x5.2x1.6mm, https://www.chilisin.com/upload/media/product/power/file/BMRx_Series.pdf Inductor, Chilisin, BMRx00040412, 4.6x4.1x1.2mm.
- 0.4P CASE 932BH (see ON.