3
1
Back

Chilisin, BMRB00050518, 5.7x5.4x1.8mm, https://www.chilisin.com/upload/media/product/power/file/BMRx_Series.pdf Inductor, Chilisin, BMRG00131360, 13.8x12.6x6.0mm, https://www.chilisin.com/upload/media/product/power/file/BMRx_Series.pdf Inductor, Chilisin, BMRA00050520, 5.7x5.4x1.8mm, https://www.chilisin.com/upload/media/product/power/file/BMRx_Series.pdf Inductor, Chilisin, BMRB00050512, 5.7x5.4x1.2mm, https://www.chilisin.com/upload/media/product/power/file/BMRx_Series.pdf Inductor, Chilisin, BMRx00040412, 4.6x4.1x1.2mm, https://www.chilisin.com/upload/media/product/power/file/BMRx_Series.pdf Inductor, Chilisin, BMRx00060630, 7.3x6.6x3.0mm, https://www.chilisin.com/upload/media/product/power/file/BMRx_Series.pdf Shielded Power Inductor WE-PDF Wuerth Handsoldering L_Wuerth_WE-TPC-3816 StepUp generated footprint, https://www.infineon.com/cms/en/product/packages/PG-LLGA/PG-LLGA-5-1/ AKM Current Sensor, 7 pin, THT (http://www.akm.com/akm/en/file/datasheet/CQ-236B.pdf akm current sensor tht AKM Current Sensor, 7 pin, SMD (http://www.akm.com/akm/en/file/datasheet/CQ-236B.pdf akm current sensor smd AKM VSOP-24 current sensor, 5.6x7.9mm body, 0.65mm pitch (http://cache.freescale.com/files/shared/doc/package_info/98ASS23330W.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf PQFP, 132 pins, 24mm sq body, 0.635mm pitch (https://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-02-databook.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf PQFP 132 Intel 386EX (https://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-02-databook.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf PQFP, 132 pins, 24mm sq body, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf DE Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad Variation BB; (see Linear Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 506AF.PDF DKD Package; 32-Lead Plastic Thin Shrink Small Outline (SO) - Wide, 5.3 mm Body [SOIC] (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf SOIC, 8 Pin (https://www.ti.com/lit/pdf/qfnd619), generated with kicad-footprint-generator Molex SPOX Connector System, 5268-08A.

New Pull Request