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And sot370-1_po.pdf SSOP56: plastic shrink small outline package; 16 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic DFN, 4mm x 3mm (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/05081731_C_DE14MA.pdf Linear UKG52(46) package, QFN-52-1EP variant (see http://cds.linear.com/docs/en/datasheet/3886fe.pdf MLF, 6 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5353.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-15S-0.5SH, 15 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST EH series connector, S28B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator Molex SPOX horizontal Molex JAE 0.2mm pitch, 1mm overall height FFC/FPC connector, FH12-50S-0.5SH, 50 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6.

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