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SPST Copal_CHS-08B, Slide, row spacing 10.16 mm (400 mils 16-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil 1x-dip-switch SPST , Slide, row spacing 5.08 mm (200 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD DIP Switch SPST Slide 7.62mm 300mil 4-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 10x-dip-switch SPST CTS_Series194-10MSTN, Piano, row spacing 10.16 mm (400 mils 16-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 64-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 20-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations variant of 8-Lead Plastic DFN (5mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF 14-lead very thin plastic quad flat, 3.0x4.5mm size, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf DE Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 18 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf 28-Lead Plastic Shrink Small Outline Narrow Body (http://www.analog.com/media/en/technical-documentation/data-sheets/ADuM7640_7641_7642_7643.pdf 24-Lead Plastic QFN (4mm x 3mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 16-Lead Plastic DFN (5mm x 4mm) (see Linear Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 506BU.PDF 8-Lead Plastic Dual Flat, No Lead Package, 3.3x3.3x0.8mm Body, https://www.diodes.com/assets/Package-Files/PowerDI3333-8.pdf Fairchild Power33 MOSFET package, 3x3mm (see https://www.fairchildsemi.com/datasheets/FD/FDMC8032L.pdf Fairchild-specific MicroPak-6.

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