Labels Milestones
Back31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition Appendix A Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments (http://www.ti.com/lit/ds/symlink/tps22993.pdf QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq25601.pdf#page=54), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8008S.pdf#page=20), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-112-02-xxx-DV-LC, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection, for 2 times 1.5 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 3.5mm, size 14x7.6mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00023_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block WAGO 236-612 45Degree pitch 5mm size 40x9mm^2 drill 1.3mm pad 2.6mm Terminal Block Phoenix MKDS-3-2-5.08, 2 pins, diameter 3.0mm 2 pins LED, diameter 3.0mm z-position of LED center 6.0mm 2 pins LED_Oval, Oval, Oval size 5.2x3.8mm^2 2 pins LED diameter 3.0mm z-position of LED center 3.0mm 2 pins LED diameter 3.0mm z-position of LED center 3.0mm 2 pins LED Round FlatTop Rectangular size 5.0x2.0mm^2 z-position of LED center 2.0mm 2 pins LED, diameter 5.0mm z-position of LED center 3.0mm 2 pins diameter 3.0mm z-position of LED center 3.0mm, 2 pins, single row style2 pin1 right Through hole socket strip SMD 1x06 2.00mm single row style1 pin1 left.
- Https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, area grid.
- Size 105x8.1mm^2 drill 1.3mm pad 2.5mm.
- SPT 5/3-H-7.5-ZB Terminal Block.
- (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=276), generated with kicad-footprint-generator Harwin Male Horizontal Surface.