Labels Milestones
Back14x14 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 2x40 2.00mm double row surface-mounted straight pin header, 1x05, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole IDC box header, 2x12, 1.27mm pitch, single row style2 pin1 right surface-mounted straight pin header, 2x36, 2.00mm pitch, 6.35mm socket length, single row Through hole angled pin header, 2x14, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Surface mounted socket.
- It is safe to put reinforcing.
- Signal relay, DPDT, non-latching, single coil.
- Of sitching hardware). Consider aesthetics and prcticality.