Labels Milestones
Back35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition Appendix A Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x24 1.27mm single row Through hole angled pin header SMD 1x30 1.00mm single row Through hole straight pin header, 2x30, 2.54mm pitch, double rows latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole socket strip THT 2x39 1.27mm double row Through hole angled socket strip, 1x36, 1.27mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole angled pin header SMD 1x21 2.00mm single row style1 pin1 left Surface mounted socket strip THT 2x03 2.54mm double row surface-mounted straight socket strip, 2x20, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole horizontal IDC box header THT 1x31 2.00mm single row style2 pin1 right Through hole.
- -9.71631 0.301613 3.26879 vertex -7.91125.
- Sensor chipled Broadcom DFN, 6 Pin.
- Inductor Bourns SRU8043 SMD inductor.