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DSS6, http://cdn-reichelt.de/documents/datenblatt/B400/DSN6NC51H.pdf, length*width=7.0x2.5mm^2 package, package length=8.0mm, package width=3.5mm, 3 pins LED diameter 5.0mm 2 pins diameter 5.0mm z-position of LED center 3.0mm 2 pins diameter 5.0mm z-position of LED center 3.0mm, 2 pins LED diameter 3.0mm z-position of LED center 3.0mm, 2 pins, http://www.kingbright.com/attachments/file/psearch/000/00/00/L-43GD(Ver.12B).pdf LED diameter 5.0mm z-position of LED center 1.0mm, 2 pins, pitch 5.08mm, hole diameter 1.1mm, length 8.5mm, width 2.8mm, e.g. Ettinger 13.13.890, https://katalog.ettinger.de/#p=434 Through hole straight pin header, 1x27, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x08, 2.54mm pitch, 8.51mm socket length, double rows Through hole socket strip SMD 2x07 2.54mm double row Through hole socket strip THT 1x13 1.00mm single row Surface mounted pin header SMD 1x40 2.54mm single row male, vertical entry connector Molex Sabre Power Connector, 43160-2104, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator connector wire 0.127sqmm double-strain-relief Soldered wire connection with double feed through strain relief, for 5 times 0.25 mm² wires, reinforced insulation, conductor diameter 0.65mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1410, with PCB locator, 14 Pins (http://www.molex.com/pdm_docs/sd/5024301410_sd.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-4DP-2DSA, 2 Pins per row (http://www.molex.com/pdm_docs/sd/428192214_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times 1.5 mm² wire, basic insulation, conductor diameter 0.5mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py ST HLGA, 10 Pin (http://rohmfs.rohm.com/en/products/databook/datasheet/ic/power/switching_regulator/bd8314nuv-e.pdf (Page 20)), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator JST SUR series connector, 78171-0004 (http://www.molex.com/pdm_docs/sd/781710002_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-137-02-xxx-DV-BE, 37 Pins per row (http://www.molex.com/pdm_docs/sd/1053131208_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation EA), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Very Thin Dual Flatpack No-Lead (LZ) - 2x3x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Dual Flat, No Lead Package - 4x4x0.9 mm Body [TQFP] (see Microchip Packaging Specification 00000049BS.pdf VQFN, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T1655-2)), generated with kicad-footprint-generator ipc_gullwing_generator.py 44-Lead Plastic Shrink Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 24 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf TSSOP, 44 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_44_05-08-1763.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-109-02-xx-DV-PE-LC, 9 Pins per row.

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