3
1
Back

Highspeed card edge connector for 2.4mm PCB's with 50 contacts (not polarized Highspeed card edge connector for PCB's with 08 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 20 contacts (not polarized Highspeed card edge connector for PCB's with 08 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 08 contacts (not polarized Highspeed card edge connector for 2.4mm PCB's with 60 contacts (polarized Highspeed card edge connector for PCB's with 20 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 05 contacts (not polarized Highspeed card edge connector for 2.4mm PCB's with 40 contacts (not polarized Highspeed card edge card connector socket for 2.36mm PCBs, vertical, alignment pins, weld tabs, board locks (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm Highspeed card edge connector for 1.6mm PCB's with 60 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 30 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 70 contacts (not polarized Highspeed card edge connector for PCB's with 30 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 40 contacts (not polarized Highspeed card edge card connector socket for 1.57mm PCBs, vertical, alignment pins, weld tabs (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm BGA-64, 10x10 raster, 4.775x5.041mm package, pitch 0.65mm VFBGA-86, 6.0x6.0mm, 86 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package, pitch 0.8mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f302vc.pdf WLCSP-100, 10x10 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A BGA 1924 1 FF1926 FFG1926 FF1927 FFG1927 FFV1927 FF1928 FFG1928 FF1930 FFG1930 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, Analog Devices (Linear Tech), 133-pin LGA uModule, 15.0x15.0x4.32mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf NXP LGA, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_WDFN_5x6mm_MF_C04210B.pdf), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MC_1,5/16-GF-3.5; number of pins: 12; pin pitch: 3.81mm; Angled || order number: 1843282 8A 160V Generic Phoenix Contact connector footprint for: MC_1,5/7-G-3.81; number of pins: 10; pin pitch: 5.00mm; Vertical || order number: 1806287 12A 630V Generic Phoenix Contact connector footprint for: MCV_1,5/7-GF-5.08; number of pins: 15; pin pitch: 3.81mm; Vertical || order number: 1806290 12A 630V Generic Phoenix Contact.

New Pull Request