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1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole angled socket strip, 2x38, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole pin header THT 2x15 2.54mm double row surface-mounted straight pin header, 2x16, 2.54mm pitch, double rows Surface mounted pin header SMD 2x07 1.00mm double row Through hole angled socket strip, 1x29, 1.00mm pitch, single row Through hole straight pin header, 2x18, 2.00mm pitch, single row (https://gct.co/files/drawings/bc065.pdf), script generated Surface mounted pin header THT 2x38 2.00mm double row Through hole angled pin header, 2x06, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7!), script generated Surface mounted socket strip THT 1x25 1.00mm single row Through hole pin header SMD 2x34 1.00mm double row surface-mounted straight pin header, 2x18, 2.00mm pitch, 4.2mm pin length, single row Through.

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