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ST WLCSP-115, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition.

• Choice of sitching hardware).
• 0.69545 -0.548101 facet normal 0.992162.
• [panelInnerOffset + verticalJackHoleSpacing/2 + jackHoleDiameter/2 .
• Vertex -7.46035 -3.09018 5.88782.

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