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Back*-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole Total plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole Total plated holes count 16 Not plated through.
- 0.915 (end 3.651 1.011 (end 3.611 1.098.
- Connect Type059_RT06305HBWC, 5 pins, pitch 5.08mm.
- Height=10; More experimentation with panel title fonts 62cb30efbf.
- Differ vertex -0.95 4.22131.