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32-lead dip package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead surface-mounted (SMD) DIP package, row spacing 5.08.

• Bauform S, Wuerth, WE-CMB, Bauform S, Wuerth.
• (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719309), generated with kicad-footprint-generator ipc_gullwing_generator.py PQFP.
• Vertex 4.25579 9.04402 0.0469873.

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