3
1
Back

2.39x2.39mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 3x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 2x04 1.27mm double row Through hole angled pin header SMD 1x17 1.27mm single row Through hole IDC box header THT 1x09 1.00mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole straight pin header, 2x17, 2.00mm pitch, 4.2mm pin length, single row Surface mounted pin header SMD 1x04 1.27mm single row style2 pin1 right Through hole pin header THT.

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