3
1
Back

Raster, 4.466x4.395mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf LFCSP VQ, 48 pin, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 64-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads THT DIP DIL ZIF 10.16mm 400mil SMDSocket SmallPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 14-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD.

New Pull Request