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Diameter*width=3.4*2.1mm^2, Capacitor, http://www.vishay.com/docs/45233/krseries.pdf C Disc series Radial pin pitch 5.00mm length 7mm width 6.5mm Capacitor C, Rect series, Radial, pin pitch=27.94mm, 7W, length*width*height=25*9*9mm^3, http://cdn-reichelt.de/documents/datenblatt/B400/5WAXIAL_9WAXIAL_11WAXIAL_17WAXIAL%23YAG.pdf Resistor Axial_Power series Box pin pitch 4.00mm diameter 6.0mm Tantal Electrolytic Capacitor CP, Axial series, Axial, Horizontal, pin pitch=12.7mm, , length*diameter=7*3.3mm^2, Fastron, MICC, http://www.fastrongroup.com/image-show/70/MICC.pdf?type=Complete-DataSheet&productType=series Inductor Axial series Axial Horizontal pin pitch 5.00mm length 7.2mm width 2.5mm solder Pin_ diameter 1.0mm, hole diameter 1.2mm (loose fit), length 10.0mm solder Pin_ diameter 1.3mm, hole diameter 1.3mm, wire diameter 1.0mm low profile wire loop as test point, loop diameter 3.8mm, hole diameter 1.0mm wire loop wire loop as test Point, diameter 3.0mm z-position of LED center 1.6mm, 2 pins LED_Rectangular, Rectangular, Rectangular size 5.0x2.0mm^2 z-position of LED center 2.0mm 2 pins LED, , diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 1.6mm 2 pins LED_Rectangular, Rectangular, Rectangular size 5.0x2.0mm^2 z-position of LED center 1.0mm, 2 pins, pitch 3.5mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Pico-Clasp series connector, SM11B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-184 , 24 Pins (http://www.molex.com/pdm_docs/sd/5024301410_sd.pdf), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, old mpn/engineering number: 1-794105-x, 9 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-116-02-xx-DV-TE, 16 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.423x2.325mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 16x16 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package.

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