synth_tools

Back

950mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 5-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 16-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x9.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 9x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 11.43mm 450mil SMDSocket LongPads 4-lead though-hole mounted DIP package, row spacing 24.13 mm (950 mils), SMDSocket, SmallPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 7x-dip-switch SPST , Piano, row spacing 10.16 mm (400 mils), LongPads 32-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 8-Lead, 300\" Wide, Surface Mount Bridge Rectifier Diode SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator JST ZE series connector, 53780-0770 (), generated with kicad-footprint-generator connector Molex top entry Molex LY 20 series connector, 502382-0370 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HVSSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/lm25085.pdf#page=32), generated with kicad-footprint-generator Molex Pico-Clasp series connector, B5P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-10DP-2DSA, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py mlf 8 2x2 mm 16-Lead Quad Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf VQFN, 16 Pin (https://www.onsemi.com/pub/Collateral/NCN4555-D.PDF), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82130.pdf#page=19), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.75 mm² wires, basic insulation, conductor diameter 2mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST XH series connector, 505405-0470 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator connector JST VH series connector, 502585-0970 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-146-02-xxx-DV, 46 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas instruments QFN Package, datasheet: https://www.ti.com/lit/ds/symlink/tpsm53602.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 19x19 grid, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A Zynq-7000 BGA.

New Pull Request

Labels Milestones