Labels Milestones
BackPlastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Small Outline No-Lead 8-Lead Plastic VSON, 3x3mm Body, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf 3x3mm Body, 0.5mm Pitch.
- -5.16382 6.86646 vertex -0.139654 -7.39048 6.87554 facet.
- RND 205-00236 pitch 5.08mm size 50.8x8.45mm^2 drill.