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YZP R-XBGA-N8 Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 16x16 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row (from Kicad 4.0.7), script generated Through hole socket strip THT 1x39 2.54mm single row style1 pin1 left Surface mounted pin header THT 1x07 2.54mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole socket strip SMD 1x22 1.00mm single row Through hole socket strip THT 1x10 5.08mm single row Surface mounted pin header SMD 1x14 2.54mm single row Through hole vertical IDC box header THT 1x29 2.54mm single row style1 pin1 left Surface mounted socket strip THT 2x09 1.00mm double row Through hole straight pin header, 2x13, 2.54mm pitch, 6mm pin length, double rows Through hole straight socket strip, 2x33, 2.54mm pitch, double rows Through hole straight pin header, 2x11, 2.54mm pitch, single row Through hole angled pin header, 1x08, 1.27mm pitch, single row Through hole angled socket strip, 2x18, 1.27mm pitch, 4.0mm pin length, single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x39, 1.00mm pitch, 2.0mm pin length, double rows Through hole straight pin header, 2x15, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Surface mounted pin header THT 1x12 2.54mm single row style1 pin1 left Surface mounted socket strip SMD 1x31 1.27mm single row Through hole angled pin header, 2x03, 1.00mm pitch, 2.0mm pin length, double rows Through hole IDC header, 2x08, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script.

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