Labels Milestones
BackWLCSP-66, 8x9 raster, 3.767x4.229mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00284211.pdf WLCSP-104, 9x12 raster, 4.095x5.094mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zd.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, ST die.
- 13.16x6.5mm^2, drill diamater 1.1mm, pad diameter 2.6mm.
- (https://katalog.we-online.de/em/datasheet/9774020951.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 16 Pin.
- -3.508232e-001 -6.139412e-001 7.071062e-001 vertex 3.439994e+000.
- Stereo horizontal TRS 3.5mm, horizontal, through-hole, https://www.cui.com/product/resource/sj1-353xng.pdf.