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Back

Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments LM25119 http://www.ti.com/lit/ds/symlink/lm25119.pdf WQFN, 42 Pin (http://www.ti.com/lit/ds/symlink/ts3l501e.pdf#page=23), generated with kicad-footprint-generator Molex JAE 0.2mm pitch, 1mm overall height FFC/FPC connector, FH12-6S-0.5SH, 6 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator Hirose series connector, B2B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated.

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