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BA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py DFN8 2x2, 0.5P (https://www.onsemi.com/pub/Collateral/511AT.PDF On Semiconductor, SIP-38, 9x7mm, (https://www.onsemi.com/pub/Collateral/AX-SIP-SFEU-D.PDF#page=19 8-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 18-Lead Plastic DFN (7mm x 4mm) (see Linear Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 506AF.PDF DKD Package; 24-Lead Plastic QFN (4mm x 3mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_8_05-08-1719.pdf DFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_WDFN_5x6mm_MF_C04210B.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 2.5 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-3991, 39 Circuits (http://www.molex.com/pdm_docs/sd/5022503991_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 0.1 mm² wires, basic insulation, conductor diameter 2mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.75 mm² wires, basic insulation, conductor diameter 2.4mm, see http://www.4uconnector.com/online/object/4udrawing/19965.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block Phoenix MKDS-3-14-5.08 pitch 5.08mm size 66x9.8mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00079 pitch 10mm size 15.8x8.2mm^2 drill 1.3mm pad 2.5mm terminal block Metz Connect Type171_RT13706HBWC, 6 pins, single row Through hole pin header SMD 1x05 1.27mm single row style2 pin1 right Through hole pin header SMD 1x38 1.00mm single row Through hole IDC header, 2x13, 1.00mm pitch, double rows Through hole angled pin header THT 1x18 2.00mm single row Through hole pin header THT 2x25 1.27mm double row Through hole angled socket strip THT 2x18 1.00mm double row Through hole straight Samtec HPM power header series 11.94mm post length THT 1x04 2.54mm single row style2 pin1 right Through hole socket strip THT 1x13 2.54mm single row Surface mounted socket strip SMD 1x36 1.00mm single row style2 pin1 right Through hole angled pin header, 2x21, 1.00mm pitch, single row Through hole socket strip SMD 1x18 2.00mm single row style1 pin1 left Surface mounted pin header THT 1x19 1.00mm single row style2 pin1 right Through hole straight socket strip, 2x19, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole socket strip THT 1x32.

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