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11x21 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, off-center ball grid, ST die ID 461, 4.63x4.15mm, 115 Ball.

• 8.83276 6.17308 vertex -5.16065.
• Solder Paste" "Name": "Bottom Solder Mask" "Name.
• Normal 2.588513e-001 1.675051e-003 9.659157e-001 vertex -8.395380e-001.
• 1.115112e+01 facet normal 0.0998673 0.114117 0.988435 facet normal.

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