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7x7, 0.4P CASE 932BH (see ON Semiconductor 506CE.PDF DD Package; 12-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed.

• 22 Apr 2021 10:45:56 AM EDT **Component Count.
• 9.0x9.0mm, 272 Ball, 17x17.
• DHVQFN, 16 Pin (https://www.ti.com/lit/ds/symlink/ts5v330.pdf#page=28 QFN, 20 Pin.
• CHK UI30 4VA Trafo, Flattrafo.
• 23 top-side contacts, 0.5mm.

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