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12-Lead (10-Lead Populated) Quad Flat No-Lead Package, 9x9mm Body (see Atmel Appnote 8826 10-Lead Plastic Dual Flat, No Lead Package - 3x3 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Quad Flat, No Lead Package (MR) - 9x9x0.9 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic Dual Flat, No Lead Package (ML) - 8x8x0.9 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad Variation BB; (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic Micro Small Outline (SN) - Narrow, 3.90 mm Body [HTSSOP], with thermal vias and counter-pad, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm, thermal vias in pads, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B13B-XASK-1-A (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Harting har-flexicon series connector, S7B-XH-A-1 (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator connector TE MATE-N-LOK top entry Molex FFC/FPC connector, FH12-11S-0.5SH, 11 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 8-Lead Plastic DFN (5mm x 4mm) (see Linear Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON.

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