Labels Milestones
BackAg5405 Ag5412 Ag5424 single output POE DCDC-Converter, 60W POE, Silvertel, pitch 2.54mm, package size 32.2x9.1x15mm^3, https://www.recom-power.com/pdf/Innoline/R-5xxxPA_DA.pdf dc-dc recom buck lga-25 pitch 2.29mm Traco TDN 5WI Series, 5W (https://www.tracopower.com/sites/default/files/products/datasheets/tdn5wi_datasheet.pdf#page=4 Traco 12W, THT (https://www.tracopower.com/sites/default/files/products/datasheets/tel12_datasheet.pdf traco dcdc tht 12w DCDC-Converter, TRACO, TEN10-xxxx, single output, SIP package style, https://power.murata.com/data/power/ncl/kdc_mej1.pdf muRata MEJ1SxxxxSC, 19.5x9.8x12.5mm, 5.2kVDC Isolated, 2W, SIP package style, https://power.murata.com/data/power/ncl/kdc_mej1.pdf Abracon Miniature Ceramic Smd Crystal ABM8AIG https://abracon.com/AIGcrystals/ABM8AIG.pdf, 3.2x2.5mm^2 package SMD Crystal Oscillator Seiko Epson MC-306 https://support.epson.biz/td/api/doc_check.php?dl=brief_MC-306_en.pdf, 8.0x3.2mm^2 package SMD Crystal Seiko Epson SG-8002CA https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-8002DC, 7.0x5.0mm^2 package Miniature Crystal Clock Oscillator ECS 2520MV series SMD inductor Bourns SRN4018 SMD inductor Inductor, Bourns, SRF1260, 12.5mmx12.5mm (Script generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 0.75 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.5 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST SH series connector, B13B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 501920-5001, 50 Pins per row (https://www.hirose.com/fr/product/document?clcode=CL0580-2218-5-05&productname=FH41-30S-0.5SH(05)&series=FH41&documenttype=2DDrawing&lang=fr&documentid=0001001704 Hirose series connector, BM08B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0230, 2 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-125-02-xxx-DV, 25 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py EQFP, 144 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4150, 15 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, BM03B-ZESS-TBT (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-2102, With thermal vias 10-Lead Plastic DFN (6mm x 5mm) (see Linear Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE 506CN (see ON Semiconductor 122BS.PDF PQFP, 100 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator JST SH series connector, LY20-34P-DLT1, 17 Circuits (http://www.molex.com/pdm_docs/sd/5022501791_sd.pdf), generated with kicad-footprint-generator JST EH series connector, LY20-14P-DLT1, 7 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas instruments QFN Package, datasheet: https://www.ti.com/lit/ds/symlink/tpsm53602.pdf Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88.
- -0.993884 vertex -1.31069 3.16429 15.2987 vertex.
- Traces_before_hard_sync traces added but maybe won't.