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Back(993 mils SMD DIP DIL PDIP 2.54mm 7.62mm 300mil PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 32-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 14-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 18-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils 24-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 5x-dip-switch SPST KingTek_DSHP05TJ, Slide, row spacing 7.62 mm (300 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD DIP DIL ZIF 15.24mm 600mil Socket 3M 16-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils Toshiba 11-7A9 package, like 6-lead dip package with 1.27mm pin pitch, compatible with Korean HRO Parts Elec TYPE-C-31-G-06 USB Type-C receptacle for USB 2.0 receptacle type B, Vertical, 2 rows 16.
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