3
1
Back

Module Astrocast radio Astronode 2.4 GHz Wi-Fi and Bluetooth combo chip https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32_datasheet_en.pdf Single 2.4 GHz Wi-Fi and Bluetooth module, https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32e_esp32-wroom-32ue_datasheet_en.pdf NINA-B111 LGA module 42 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/05081875_0_UHE42.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 1-770182-x, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex SPOX Connector System, 53048-0310, 3 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 28 Pin (JEDEC MO-153 Var GD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-138-02-xx-DV-PE-LC, 38 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP24: plastic shrink small outline package; 10 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 48 leads; body width 7.5 mm; (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm (see NXP sot054_po.pdf TO-92 leads molded, wide, drill 0.75mm (http://www.produktinfo.conrad.com/datenblaetter/175000-199999/181293-da-01-de-TO92_Temperatursensor_PT1000_32209225.pdf Molded Japan Transistor Package 7x4x9mm^3, http://rtellason.com/transdata/2sb734.pdf Non Isolated Modified TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Vertical RM 5.45mm TO-3P-3, Vertical, RM 2.54mm, staggered type-1 TO-220-9 Vertical RM 10.9mm TO-264-2, Vertical, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220-9 Vertical 2.54mm Pitch Multiwatt 8 TO-220-9, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Horizontal RM 0.97mm Multiwatt-9 staggered type-2 TO-220-7 Vertical RM 0.9mm staggered type-2 TO-220-9, Vertical, RM 10.9mm, see https://diotec.com/tl_files/diotec/files/pdf/datasheets/pb1000.pdf Single phase bridge rectifier case 28.6x28.6mm, pitch 18.0mm & 11.6mm, see https://diotec.com/tl_files/diotec/files/pdf/datasheets/kbpc1500fw.pdf Diotec 32x5.6x17mm rectifier package, 5.08mm pitch, single row Through hole angled pin header, 1x25, 2.00mm pitch, single row style2 pin1 right Through hole straight pin header, 2x34, 2.00mm pitch, single row Through hole socket strip SMD 1x15 2.00mm single row style1 pin1 left Surface mounted pin header THT 1x32 2.54mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x39 2.00mm double row Through hole straight pin header, 2x10, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x13 1.27mm single row Through hole straight socket strip, 2x39, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 1x05 2.54mm single row Surface mounted pin header SMD 1x19 1.00mm single row Through hole IDC header, 2x25, 2.54mm pitch, 8.51mm socket length, single row style2 pin1 right Through hole angled pin header, 1x26, 1.00mm pitch, single row male, vertical entry, no latches, PN:G125-MVX5005L0X Harwin Gecko Connector, 16 pins, dual row male.

New Pull Request